Texas Instruments (TI) officially broke ground on its new 12 inch semiconductor wafer manufacturing base
Time:2022-05-23
Views:2052
Source: Huaqiang electronic network
The wafer manufacturing base is located in Sherman, Texas, with a total investment of US $30 billion
On May 19, Texas Instruments announced today that its new 12 inch semiconductor wafer manufacturing base in Sherman, Texas has officially broken ground. At the commencement ceremony, Mr. rich Templeton, chairman, President and CEO of Texas Instruments, celebrated the official start of the construction of the base and reiterated the commitment of Texas Instruments to expand its own long-term manufacturing capacity.
Mr. rich Templeton, chairman, President and CEO of Texas Instruments, and other company leaders attended the commencement ceremony of Sherman‘s new 12 inch semiconductor wafer manufacturing base
Mr Templeton said: "Today is an important milestone. We will lay a foundation for the development of semiconductors in the field of electronic products to meet the needs of customers in the coming decades. Since the establishment of the company for more than 90 years, we have been committed to making electronic products more economical and practical through semiconductor technology and making the world a better place. We are glad that Sherman‘s advanced 12 inch semiconductor wafer manufacturing base will help Ti continuously improve its manufacturing capacity and technological competitive advantage. ”
With an investment of about US $30 billion, the project plans to build four factories to meet the long-term market demand. These new factories will manufacture tens of millions of analog and embedded processing chips every day, which are widely used in all kinds of electronic products in the global market.
Sustainable manufacturing
The wafer manufacturing base is located in Sherman, Texas, with a total investment of US $30 billion
On May 19, Texas Instruments announced today that its new 12 inch semiconductor wafer manufacturing base in Sherman, Texas has officially broken ground. At the commencement ceremony, Mr. rich Templeton, chairman, President and CEO of Texas Instruments, celebrated the official start of the construction of the base and reiterated the commitment of Texas Instruments to expand its own long-term manufacturing capacity.
Mr. rich Templeton, chairman, President and CEO of Texas Instruments, and other company leaders attended the commencement ceremony of Sherman‘s new 12 inch semiconductor wafer manufacturing base
Mr Templeton said: "Today is an important milestone. We will lay a foundation for the development of semiconductors in the field of electronic products to meet the needs of customers in the coming decades. Since the establishment of the company for more than 90 years, we have been committed to making electronic products more economical and practical through semiconductor technology and making the world a better place. We are glad that Sherman‘s advanced 12 inch semiconductor wafer manufacturing base will help Ti continuously improve its manufacturing capacity and technological competitive advantage. ”
Design concept drawing of Texas Instruments Sherman‘s new 12 inch semiconductor wafer manufacturing base
With an investment of about US $30 billion, the project plans to build four factories to meet the long-term market demand. These new factories will manufacture tens of millions of analog and embedded processing chips every day, which are widely used in all kinds of electronic products in the global market.
Sustainable manufacturing
Ti has always been committed to the long-term commitment of responsible and sustainable manufacturing. The new plant will be designed according to the standard of LEED gold certification, which is one of the highest standards in LEED building rating in terms of structural efficiency and sustainable development. By adopting advanced 12 inch wafer manufacturing equipment and processes, the new plant will further reduce waste emissions and reduce water and energy consumption.
Investment in 12 inch wafer manufacturing
The first plant in Sherman wafer manufacturing base is expected to start production in 2025. The wafer manufacturing base will join ti‘s existing 12 inch wafer manufacturing plant camp, including dmos6 in Dallas, Texas; Rfab1 in Richardson, Texas and rfab2, which is about to be completed and is expected to be put into operation in the second half of 2022; And LFAB in Lehi, Utah, which is expected to be put into operation in early 2023. "Our continued investment in long-term capacity will further enhance the company‘s cost advantage and strengthen our control over the supply chain," Mr. Templeton said
For a long time, Ti has continuously invested in long-term production capacity and continuously improved its manufacturing capacity and technological competitive advantage to support the growth of customers in the coming decades. Ti‘s manufacturing base in Chengdu, China integrates wafer manufacturing, packaging, testing, bump processing and wafer testing. At present, the second packaging / testing plant is being expanded.
For a long time, Ti has continuously invested in long-term production capacity and continuously improved its manufacturing capacity and technological competitive advantage to support the growth of customers in the coming decades. Ti‘s manufacturing base in Chengdu, China integrates wafer manufacturing, packaging, testing, bump processing and wafer testing. At present, the second packaging / testing plant is being expanded.
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