Main trends of PCB development in 2022
Time:2022-06-10
Views:1995
With the tremendous impact of the latest technologies such as 5g, Internet of things and artificial intelligence on the electronic world, the PCB manufacturing industry has developed a lot. New trends in PCB development are catching up quickly. It is estimated that the global PCB market in 2023 will be about US $70-75 billion.
Various fields related to PCB are developing at the same time, including: direct imaging, in which circuit patterns are directly printed on materials; New substrate materials; A new method for measuring surface finish; Flexible PCB; Degree of automation of manufacturing process; And more environmentally friendly.
The root of these technical trends is the growth of PCB demand in the market.
Communication speed is developing rapidly with 5g technology network. IOT technology has created specific IOT devices for almost every industry, including industrial automation, smart home, healthcare and wearable devices. Artificial intelligence and machine learning have penetrated into fields outside the manufacturing or assembly workshop.
Wearable devices, such as glasses, chip implants or prosthetics. Automatic driving technology is used to realize different levels of function or action automation, including driverless cars and UAVs.
PCB development trends listed in the global PCB Market
There are different requirements for different technical fields of PCB, such as changing the shape of PCB or related accessories. Recently, camera modules have made significant progress to improve high-resolution image and video imaging. Vehicle mounted cameras will become a strong demand outside the consumer electronics and industrial fields.
3D printing Electronics (3D PE) is changing the design of electrical systems. 3D PE is an additive manufacturing process, which can build 3D circuits by printing substrates layer by layer. 3D printing allows rapid prototyping in a very short time. The minimum build amount is not required. Using this printing technology, no plate making process is required. Due to automation, this will expand product functionality and improve overall efficiency.
Compared with traditional PCBs, high density interconnect (HDI) PCBs provide high performance and extremely thin materials. This provides compact wiring, tiny laser vias and pads. HDI PCB is the first choice for miniaturized electronic products.
With the increase of mobile phone and Internet TV subscriptions, consumer electronics is one of the fastest growing trends. Wearable devices such as smart watches have also contributed to the expansion of the consumer sector. These applications are increasing the demand for compact, accurate and multifunctional PCBs. In addition, due to their durability and size advantages, the latest Internet of things applications are promoting the development of flexible and rigid flexible PCBs.
The extensive use of chips in the semiconductor industry has forced PCB experts to study new alternatives. Non degradable electronic waste has also seriously affected the environment, leading designers to explore organic or biodegradable PCBs as alternatives.
Solutions that support artificial intelligence are now at the forefront of almost all industrial fields. The application of artificial intelligence is creating the demand for PCB design and manufacturing process improvement. Focusing on accelerating the development cycle to reduce defects and quickly deliver products is a key goal to maintain the growing PCB industry.
Traditionally, PCB is a passive medium used to connect active components of circuit design. Recently, however, designers have been exploring the possibility of making PCB itself an active component of the circuit. This approach reduces the requirements of components while performing the required functions.
Technology trends such as augmented reality (AR) and virtual reality (VR) are dominating the field of consumer electronics and affecting PCB design to solve problems such as installing electronic packages in unconventional shapes. This will confirm correct circuit operation and reduce the technical requirements for layout and wiring. In addition, AR with software simulation method can reduce the cost of training program, because advanced simulation can replicate the actual environment of magnetic field and electric field. This will
confirm that the product complies with the required regulations.
The demand for electric vehicles and autonomous vehicle is growing rapidly, and the requirements for PCB with good heat dissipation capacity are becoming higher and higher. Advanced automobile PCB design will solve the problems of safety, convenience and environment. New energy sources such as power electronics will need PCB with excellent thermal design. High current requirements and heat generation should be addressed during PCB design. It is mandatory to select enhanced PCB harness and follow effective layout strategy.
The complex design requirements for Multilayer PCB manufacturing cover all applications. PCB in medical and aerospace applications need to strictly control EMI. In addition, mobile phone developers need to minimize unnecessary radiation hazards. If the PCB design does not comply with EMI regulations, a large number of circuit boards may eventually be redesigned, increasing costs and delaying final delivery. The increasing popularity of flexible PCB also brings new challenges to PCB designers. The possibility of electromagnetic interference between components and wiring in flexible PCB is very high, resulting in performance degradation. This problem contributed to the demand for built-in ESD protection system.
With the development of the trend, the speed of PCB design and development has been greatly improved. But by spending more time designing, manufacturing and assembling products, errors and debugging costs can be reduced.
With the PCB development trend changing with the latest technological innovation, PCB manufacturers will have to establish a more dynamic supply chain and flexible manufacturing process to meet the requirements of these PCB trends.
Various fields related to PCB are developing at the same time, including: direct imaging, in which circuit patterns are directly printed on materials; New substrate materials; A new method for measuring surface finish; Flexible PCB; Degree of automation of manufacturing process; And more environmentally friendly.
The root of these technical trends is the growth of PCB demand in the market.
Communication speed is developing rapidly with 5g technology network. IOT technology has created specific IOT devices for almost every industry, including industrial automation, smart home, healthcare and wearable devices. Artificial intelligence and machine learning have penetrated into fields outside the manufacturing or assembly workshop.
Wearable devices, such as glasses, chip implants or prosthetics. Automatic driving technology is used to realize different levels of function or action automation, including driverless cars and UAVs.
PCB development trends listed in the global PCB Market
There are different requirements for different technical fields of PCB, such as changing the shape of PCB or related accessories. Recently, camera modules have made significant progress to improve high-resolution image and video imaging. Vehicle mounted cameras will become a strong demand outside the consumer electronics and industrial fields.
3D printing Electronics (3D PE) is changing the design of electrical systems. 3D PE is an additive manufacturing process, which can build 3D circuits by printing substrates layer by layer. 3D printing allows rapid prototyping in a very short time. The minimum build amount is not required. Using this printing technology, no plate making process is required. Due to automation, this will expand product functionality and improve overall efficiency.
Compared with traditional PCBs, high density interconnect (HDI) PCBs provide high performance and extremely thin materials. This provides compact wiring, tiny laser vias and pads. HDI PCB is the first choice for miniaturized electronic products.
With the increase of mobile phone and Internet TV subscriptions, consumer electronics is one of the fastest growing trends. Wearable devices such as smart watches have also contributed to the expansion of the consumer sector. These applications are increasing the demand for compact, accurate and multifunctional PCBs. In addition, due to their durability and size advantages, the latest Internet of things applications are promoting the development of flexible and rigid flexible PCBs.
The extensive use of chips in the semiconductor industry has forced PCB experts to study new alternatives. Non degradable electronic waste has also seriously affected the environment, leading designers to explore organic or biodegradable PCBs as alternatives.
Solutions that support artificial intelligence are now at the forefront of almost all industrial fields. The application of artificial intelligence is creating the demand for PCB design and manufacturing process improvement. Focusing on accelerating the development cycle to reduce defects and quickly deliver products is a key goal to maintain the growing PCB industry.
Traditionally, PCB is a passive medium used to connect active components of circuit design. Recently, however, designers have been exploring the possibility of making PCB itself an active component of the circuit. This approach reduces the requirements of components while performing the required functions.
Technology trends such as augmented reality (AR) and virtual reality (VR) are dominating the field of consumer electronics and affecting PCB design to solve problems such as installing electronic packages in unconventional shapes. This will confirm correct circuit operation and reduce the technical requirements for layout and wiring. In addition, AR with software simulation method can reduce the cost of training program, because advanced simulation can replicate the actual environment of magnetic field and electric field. This will
confirm that the product complies with the required regulations.
The demand for electric vehicles and autonomous vehicle is growing rapidly, and the requirements for PCB with good heat dissipation capacity are becoming higher and higher. Advanced automobile PCB design will solve the problems of safety, convenience and environment. New energy sources such as power electronics will need PCB with excellent thermal design. High current requirements and heat generation should be addressed during PCB design. It is mandatory to select enhanced PCB harness and follow effective layout strategy.
The complex design requirements for Multilayer PCB manufacturing cover all applications. PCB in medical and aerospace applications need to strictly control EMI. In addition, mobile phone developers need to minimize unnecessary radiation hazards. If the PCB design does not comply with EMI regulations, a large number of circuit boards may eventually be redesigned, increasing costs and delaying final delivery. The increasing popularity of flexible PCB also brings new challenges to PCB designers. The possibility of electromagnetic interference between components and wiring in flexible PCB is very high, resulting in performance degradation. This problem contributed to the demand for built-in ESD protection system.
With the development of the trend, the speed of PCB design and development has been greatly improved. But by spending more time designing, manufacturing and assembling products, errors and debugging costs can be reduced.
With the PCB development trend changing with the latest technological innovation, PCB manufacturers will have to establish a more dynamic supply chain and flexible manufacturing process to meet the requirements of these PCB trends.
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