SDSoW gathers strength to "break the wall", helping China chips to "break through the adversity", and the "5th Software Defined System-on-Chip Technology and Industry Alliance Conference" will be held soon.
Time:2022-12-02
Views:1372
Author: SDSoW Alliance
In order to closely follow the national science and technology strategy and maximize the integration of technology, industry and financial forces, the "Fifth Software Definition On Chip System Technology and Industry Alliance Conference" will be held on December 10-11. With the theme of "Jointly Building the ‘Core‘ Era of the On Crystal System", the conference will invite Wu Jiangxing, the chief scientist of the Software Definition On Crystal System (SDSoW) Alliance, and other eight academicians and industry experts to make cutting-edge scientific and technological reports, gather the government, universities, enterprises and institutions to conduct in-depth discussions on the key core technologies, processes and design of SDSoW, and form a united front of "government, industry, university, research and research funds", Forward looking vision helps Chinese chip "overtake by changing lanes".
Based on national conditions, develop strengths and avoid weaknesses
In recent years, the United States has seriously hindered the development of China‘s semiconductor industry through a series of control over "choke" key technologies. Not long ago, the United States amended its export control regulations, which caused great damage to the global semiconductor industry chain and further hampered the development of China‘s advanced computing chips. At the same time, the whole industry is faced with the difficulties of 3nm chips. It has become an established fact that the silicon manufacturing process is approaching the physical limit. The evolution of Moore‘s Law has slowed down, and some people in the industry have even made a sound of decline... All kinds of pressures make the road of China‘s semiconductor to self-reliance more difficult.
For a long time, China‘s semiconductor industry has been seriously constrained by others. If we use conventional tracking thinking and blindly build a house on others‘ foundation, the higher the building, the more serious the problem of being "stuck". It is not only difficult to catch up, can not exceed, and there is no way to talk about independent innovation. Only by keeping innovation and finding a new way can we "change lanes and overtake". In the face of strong sanctions from the United States, SDSoW technology is considered by the industry to be an innovative direction that can bypass the barriers of advanced manufacturing processes and significantly improve the comprehensive benefits of the system, which is conducive to China‘s semiconductor industry based on the current national conditions and to develop strengths and avoid weaknesses.
Changing to SDSoW is imminent
In 2019, Wu Jiangxing, an academician of the CAE Member, led the team to propose a software defined system on crystal (SDSoW) that "can achieve a first-class system based on one or two generations of backward materials and processes" based on the system engineering theory, integrating architecture and integrated process innovation, and evolving the engineering technology route of large-scale information infrastructure from "layer by layer" to heterogeneous materials The "splicing and assembling type" of heterogeneous integration of various core particles with different manufacturing processes. This has provided strategic support for China‘s chips to solve the "choke" dilemma and achieve "lane changing overtaking", and is expected to help China‘s chips find a way to break through the barrier of independent innovation that is weakly related to the blockade process.
SDSoW is one of the few technological and industrial directions that can be independently developed. It can be widely used in data centers, high-performance computing, intelligent computing, computing power networks and other national and people‘s livelihood information infrastructures, as well as in command and control, network communication, radar, electronic warfare and other key national defense information infrastructures. It is called "strategic grasp direction" and has been listed in the Strategic Research on Science and Technology Development in the Information Field for 2035, The 14th Five Year Plan for Science and Technology of the Ministry of Science and Technology of the People‘s Republic of China, the Science and Technology Commission of the Military Commission, and other research projects of Zhijiang Laboratory, Zijinshan Laboratory, and Songshan Laboratory. Under the current situation, the development of SDSoW is of dual strategic significance for China to solve the "choke" problem in the short term and to change lanes to overtake in the medium and long term. Therefore, it is extremely urgent to switch to the SDSoW industry.
Gather wisdom and innovate to lead the future
It is reported that the "5th Software Definition On Chip System Technology and Industry Alliance Conference" is aimed at SDSoW related topics, gathering the most top and authoritative scientific and technological forces and government resources in China. It is composed of the Information and Electronic Engineering Department of the Chinese Academy of Engineering, the Science and Technology Innovation Department of the Chinese Association for Science and Technology, the China Electronics Technology Group Co., Ltd., the China Electronics Information Industry Group Co., Ltd., the China Aerospace Science and Engineering Group Co., Ltd., the China Electronics Society Under the guidance of China Communication Society, Tianjin Association for Science and Technology, Tianjin Binhai New Area Industry and Information Bureau, Tianjin Binhai New Area Science and Technology Association and Tianjin Integrated Circuit Industry Association, National Digital Switching System Engineering Technology Research Center, Tsinghua University, Zhijiang Laboratory, Songshan Laboratory, Zijinshan Laboratory, Software Definition On Crystal System Technology and Industry Alliance Tianjin Binhai New Area Information Technology Innovation Center and Tianjin Information Technology Application and Innovation Industry (Talent) Alliance jointly sponsored.
At the main forum of the General Assembly on December 10, 8 academicians will make a forward-looking keynote report. On the 11th, the guests will conduct intelligent exchanges on topics such as the design of the system architecture of the on chip system, the process and integration of the on chip system, and the software and tools of the on chip system. At the same time, the conference will also set up 9 sub forums, including the Future Semiconductor, Micro nano Electronics, Information Photon, Advanced Computing, Multimodal Network, and Artificial Intelligence, in conjunction with the Expert Group of the Ministry of Science and Technology‘s Key R&D Programs and the National Natural Science Foundation of China.
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