Dymax Demas released light-cured materials for the assembly of consumer electronic wearable smart devices
Time:2023-03-14
Views:1045
Considering skin sensitization
Dymax Demas, an advanced manufacturer of rapid curing materials and equipment, is now introducing a new generation of 9200-W series of light curing optical positioning adhesives for encapsulation and structural bonding, which do not contain known skin sensitization materials.
The new series of products can solve the skin sensitization problems related to the assembly of consumer electronic wearable smart devices (such as smart bracelets, smart watches, wireless headphones, AV/VR headphones and other devices in close contact with skin). 9200-W series UV curing materials are prepared with low allergenic raw materials, with stable performance and reliable quality. The product does not contain known skin irritants, such as IBOA. These products can be used alone or together in the same device to create an overall protection solution. Dymax Dimas can also customize the material formula to meet specific application requirements.
Application points of Dymax 9200-W series adhesive
The packaging adhesive and structural adhesive without IBOA can effectively solve many challenges related to the assembly of wearable devices, such as unsealed equipment or customer‘s product material restriction requirements. The 9200-W series can be used in a variety of applications to achieve the effect of fixing and protecting parts and preventing components from moving, such as structural bonding, sensor encapsulation, lens alignment and selective coating.
9200-W series products can be cured "as needed" by UV/LED irradiation, and some products also have the characteristics of secondary moisture curing in shaded areas. Although the products are not developed for direct contact with skin, they are applicable to the assembly and application of wearable devices, and will not cause skin allergy due to the dissolution or precipitation of short-term or long-term wearable devices.
9201-W bonding and packaging materials used for wire bonding, on-board chips or on-board flexible circuits have passed reliability tests such as thermal shock, thermal cycle and vibration, and have good electrical insulation, chemical corrosion resistance and weather resistance. The low-shrinkage 9202-W adhesive used for optical alignment and lens positioning has high viscosity and high reliability, is easy to shape, and ensures the high quality and clarity of the terminal product image. 9210-W packaging adhesive, specially introduced for FPC reinforcement, selective coating and component packaging, has shown excellent performance in reliability testing. When the coating is applied to the shaded area, the light can be used for initial curing, and then the moisture can be used for secondary curing. The low-stress 9211-W plastic adhesive suitable for the assembly and application of CCM camera module is a new product for the assembly and application of lens tube and lens base, which has good adhesion to PC, LCP, ABS and FR4 substrates.
About Dymax
Dymax Demas developed and innovated rapid curing and light curing materials, dispensing equipment and UV/LED light curing system. The adhesive, coating and equipment produced by the company can be used together to greatly improve the manufacturing efficiency. The main application markets include medical devices, consumer electronics, automotive electronics, aerospace and national defense.
|
Disclaimer: This article is transferred from other platforms and does not represent the views and positions of this site. If there is any infringement or objection, please contact us to delete it. thank you! |
Business consulting
13823761625
Mail me