This Wi Fi/Bluetooth combination makes it easy for you to add IoT connectivity features
Time:2024-03-15
Views:146
Author: Bill Schweber
RF circuit designers are still considered experts who can blend magic and art. Despite advanced modeling and simulation tools, there are still many unexpected situations when implementing RF hardware. It is precisely because of these accidents that RF designers should have rich experience and the ability to investigate, test, and debug in order to meet today‘s performance and DC power usage requirements.
Using manual methods to achieve these indicators is quite challenging, but it can still be achieved at frequencies as high as several hundred megahertz (MHz). At frequencies higher than this, due to budget constraints, short time to market, strict regulatory requirements, and increasing performance demands from end-users, manual methods have reached their limits.
Today‘s wireless link design should meet the following requirements:
·Excellent performance with support for multiple wireless frequency bands
·Can connect to both Wi Fi and Bluetooth simultaneously
·Minimal design import, debugging, and integration workload
·Use minimal circuit board area and DC power supply
·Complies with relevant IEEE wireless technology standards
·Meet regulatory requirements for numerous strict parameters such as out of band radiation, electromagnetic interference (EMI), and radio frequency interference (RFI)
·Can be manufactured in bulk and at a low cost (without manual adjustment)
The DIY method using discrete components cannot meet these requirements. In addition to manual adjustments and production, discrete components also pose challenges in terms of space, cost, inventory, and procurement.
Another method is to use chipsets, where the ICs can come from one or more suppliers. However, it may be daunting to make these independent ICs and their related discrete devices work together, and the need to pass regulatory approval testing also leads to time to market issues.
Powerful ICs have various functions, characteristics, and convenience
Fortunately, the connectivity challenge has been simplified. Infineon Technologies AG‘s AIROC CYW5557x series combination (combo) Wi Fi and Bluetooth System on Chip (SoC) is a good example (Figure 1). This product can provide seamless, high-performance Internet of Things (IoT) connectivity while minimizing operational power consumption.
Figure 1: The CYW5557x series combines Wi Fi and Bluetooth connectivity capabilities of IoT devices. (Image source: Infineon Technologies)
This series of products supports Wi Fi 6/6E functionality and has three band (2.4 GHz, 5 GHz, and 6 GHz) capabilities. It offers 1x1 single input, single output (SISO) and 2x2 multi input, multi output (MIMO) antenna array configurations. This series also integrates a Power Management Unit (PMU).
Wi Fi radio is connected to the host processor via PCIe v3.0 Gen2 or SDIO 3.0 interface, while the Bluetooth host interface uses a high-speed 4-wire UART interface. In addition, CYW5557x also supports PCM and I2S interfaces for Bluetooth audio applications, as well as coexisting interfaces for external LTE and IEEE 802.15.4 chips.
CYW55572 supports:
·Wi Fi 6 (2.4 GHz, 5 GHz), 2x2 MIMO 1st and 2nd versions Features: Orthogonal Frequency Division Multiple Access (OFDMA), Multi User MIMO (MU-MIMO), Target Wait Time (TWT), and Dual Carrier Modulation (DCM)
·20/40/80 MHz channel, 1024 orthogonal amplitude modulation (QAM), and up to 1.2 gigabits per second (Gbps) physical layer (PHY) data transmission rate
·Larger range, power saving, and network efficiency
·Multiple layers of security can protect various subsystems throughout the entire product lifecycle
·Wi Fi coexists intelligently with Bluetooth or external LTE or 15.4 wireless devices
·LE audio with Auracast broadcast function
·20 dB Bluetooth transmission options with a baseline of 1 milliwatt (dBm), 13 dBm, or 0 dBm
Similar CYW55573 series products offer Wi Fi 6/6E tri band Wi Fi connectivity (2.4 GHz, 5 GHz, and 6 GHz), making it different from CYW55572.
The advantages of the CYW5557x series are not limited to the basic support functions mentioned above, but also include:
·Extremely low latency and virtual synchronization dual frequency operation function, achieving seamless audio and video streaming
·Expand the range to ensure that the device remains connected to the remote access point
·Stronger network robustness to ensure optimal transmission of video/audio streams in congested or overlapping network environments
·Advanced power-saving features that can maximize battery life
·Network uninstallation function can save system power consumption
·Multiple layers of security can protect various subsystems throughout the entire product lifecycle
In addition, these devices operate at temperatures ranging from -40 ° C to+85 ° C and are packaged in FCBGA, WLCSP, and WLBGA.
No need to restart complex designs
The CYW5557x chipset has comprehensive functionality, but each design requires relevant components, including DC-DC regulators, bypass passive devices, and appropriate circuit board layouts.
You don‘t need to design new circuit boards from scratch, you can leverage modules that have been certified by regulations and can be directly put into production, thereby accelerating product time to market. Just install the connection software, verify the design, and then you can start production.
For example, the EAR00413 2EA M.2 evaluation module of Embedded Artists AB (developed in collaboration with Murata Electronics and using its 2EA module) allows you to quickly and easily start application development (Figure 2). This PCIe compatible interface board adopts M.2 external dimensions (22x44 mm), uses the AIROC CYW55573 chipset, supports Wi Fi 6E, 802.11 a/b/g/n/ac/ax 2x2 MIMO, and Bluetooth 5.2 connectivity.
Figure 2: AIROC CYW55573‘s EAR00413 evaluation board adopts M.2 shape. (Image source: Embedded Artists AB)
This evaluation board is a standardized plug and play certified solution with access to well maintained software drivers (Linux SDK) and additional support from Embedded Artists, including advanced debugging support.
Another benefit for designers is that they do not need to have specialized knowledge in radio frequency. The specification sheet recognizes specific single band and multi band SISO and MIMO antennas provided by third parties.
epilogue
Implementing and supporting high-performance, low-power data links for the latest versions of Wi Fi and Bluetooth is a design and debugging challenge. Infineon Technologies‘ high integration CYW5557x Wi Fi/Bluetooth combination SoC with third-party modules and software support can simplify processes and shorten the time to market for IoT design.
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